Sang Hyun Park, Tae Jin Kim, Han Eol Lee, Boo Soo Ma, Myoung Song, Min Seo Kim, Jung Ho Shin, Seung Hyung Lee, Jae Hee Lee, Young Bin Kim, Ki Yun Nam, Hong-Jin Park, Taek-Soo Kim, Keon Jae Lee
Transfer printing of inorganic thin-film semiconductors has attracted considerable attention to realize high-performance soft electronics on unusual substrates. However, conventional transfer technologies including elastomeric transfer printing, laser-assisted transfer, and electrostatic transfer still have challenging issues such as stamp reusability, additional adhesives, and device damage. Here, a micro-vacuum assisted selective transfer is reported to assemble micro-sized inorganic semiconductors onto unconventional substrates...
November 26, 2023: Nature Communications