Seunguk Song, Se-Yang Kim, Jinsung Kwak, Yongsu Jo, Jung Hwa Kim, Jong Hwa Lee, Jae-Ung Lee, Jong Uk Kim, Hyung Duk Yun, Yeoseon Sim, Jaewon Wang, Do Hee Lee, Shi-Hyun Seok, Tae-Il Kim, Hyeonsik Cheong, Zonghoon Lee, Soon-Yong Kwon
As the elements of integrated circuits are downsized to the nanoscale, the current Cu-based interconnects are facing limitations due to increased resistivity and decreased current-carrying capacity because of scaling. Here, the bottom-up synthesis of single-crystalline WTe2 nanobelts and low- and high-field electrical characterization of nanoscale interconnect test structures in various ambient conditions are reported. Unlike exfoliated flakes obtained by the top-down approach, the bottom-up growth mode of WTe2 nanobelts allows systemic characterization of the electrical properties of WTe2 single crystals as a function of channel dimensions...
February 6, 2019: Advanced Science (Weinheim, Baden-Wurttemberg, Germany)